Tsawg Expansion Layers thiab Thermal Paths rau cua sov Sinks, Lead Frames, Multi-layer Printed Circuit Boards (PCBs), thiab lwm yam.
Cov khoom siv cua sov hauv lub dav hlau, cov khoom siv hluav taws xob hauv lub radar.
1. CMC composite txais cov txheej txheem tshiab, multilayer tooj liab-molybdenum-tooj liab, kev sib txuas ntawm tooj liab thiab molybdenum yog nruj, tsis muaj qhov sib txawv, thiab yuav tsis muaj kev cuam tshuam oxidation thaum lub sij hawm tom qab kub dov thiab cua sov, kom lub zog sib txuas ntawm molybdenum thiab tooj liab yog zoo heev, Yog li ntawd cov khoom tiav muaj qhov qis tshaj thermal expansion coefficient thiab zoo thermal conductivity;
2. Qhov sib piv molybdenum-tooj liab ntawm CMC yog qhov zoo heev, thiab qhov sib txawv ntawm txhua txheej yog tswj tsis pub dhau 10%; Cov khoom siv SCMC yog cov khoom siv ntau txheej. Cov txheej txheem muaj pes tsawg leeg ntawm cov khoom los ntawm sab saum toj mus rau hauv qab yog: daim ntawv tooj liab - molybdenum ntawv - tooj liab ntawv - molybdenum ntawv ... tooj liab ntawv, nws muaj peev xwm ua los ntawm 5 txheej, 7 txheej los yog txawm ntau txheej. Piv nrog CMC, SCMC yuav muaj qhov qis tshaj thermal expansion coefficient thiab siab tshaj thermal conductivity.
Qib | Qhov ceev g / cm3 | Coefficient ntawm thermalKev nthuav dav × 10-6 (20 ℃) | Thermal conductivity W / (M·K) |
CMC 111 | 9.32 ib | 8.8 ib | 305 (XY) / 250 (Z) |
CMC 121 | 9.54 ib | 7.8 ib | 260 (XY) / 210 (Z) |
CMC131 | 9.66 ib | 6.8 | 244 (XY) / 190 (Z) |
CMC141 | 9.75 ib | 6 | 220 (XY) / 180 (Z) |
CMC13/74/13 | 9.88 ib | 5.6 | 200 (XY) / 170 (Z) |
Khoom siv | Wt%Molybdenum Cov ntsiab lus | g/cm3Qhov ntom | Thermal conductivity ntawm 25 ℃ | Coefficient ntawm thermalKev nthuav dav ntawm 25 ℃ |
S-CMC | 5 | 9.0 ib | 362 ib | 14.8 ib |
10 | 9.0 ib | 335 | 11.8 ib | |
13.3 | 9.1 | 320 | 10.9 | |
20 | 9.2 ib | 291 ib | 7.4 ib |